W/WN/poly gate implementation for sub-130 nm vertical cell DRAM

R. Malik, L. Clevenger, I. McStay, O. Gluschenkov, W. Robl, P. Shafer, G. Stojakovic, W. Yan, M. Naeem, R. Ramachandran, K. Wong, J. Prakash, W. Kang, Y. Li, R. Vollertsen, A. Strong, W. Bergner, R. Divakaruni, G. Bronner
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引用次数: 2

Abstract

In this paper, we present the implementation of W/WN/poly gates in a 135 nm sub-8F2 vertical cell DRAM technology with dual gate oxide planar support transistors. Key features include low sheet resistance wordlines, high performance peripheral logic circuitry and a scalable memory cell array. A process flow detailing the decoupling of the array and support regions of the DRAM to achieve planar support transistors with L/sub eff/(nFET)<140 nm is discussed.
130 nm以下垂直单元DRAM的W/WN/多栅极实现
在本文中,我们提出了在135 nm亚8f2垂直单元DRAM技术中使用双栅氧化物平面支撑晶体管实现W/WN/多栅极。主要特点包括低片阻字线,高性能外围逻辑电路和可扩展的存储单元阵列。详细讨论了DRAM阵列和支撑区去耦的工艺流程,以实现L/sub /(nFET)<140 nm的平面支撑晶体管。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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