Leveraging Machine Learning for Gate-level Timing Estimation Using Current Source Models and Effective Capacitance

Dimitrios Garyfallou, Anastasis Vagenas, Charalampos Antoniadis, Y. Massoud, G. Stamoulis
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引用次数: 4

Abstract

With process technology scaling, accurate gate-level timing analysis becomes even more challenging. Highly resistive on-chip interconnects have an ever-increasing impact on timing, signals no longer resemble smooth saturated ramps, while gate-interconnect interdependencies are stronger. Moreover, efficiency is a serious concern since repeatedly invoking a signoff tool during incremental optimization of modern VLSI circuits has become a major bottleneck. In this paper, we introduce a novel machine learning approach for timing estimation of gate-level stages using current source models and the concept of multiple slew and effective capacitance values. First, we exploit a fast iterative algorithm for initial stage timing estimation and feature extraction, and then we employ four artificial neural networks to correlate the initial delay and slew estimates for both the driver and interconnect with golden SPICE results. Contrary to prior works, our method uses fewer and more accurate features to represent the stage, leading to more efficient models. Experimental evaluation on driver-interconnect stages implemented in 7 nm FinFET technology indicates that our method leads to 0.99% (0.90 ps) and 2.54% (2.59 ps) mean error against SPICE for stage delay and slew, respectively. Furthermore, it has a small memory footprint (1.27 MB) and performs 35× faster than a commercial signoff tool. Thus, it may be integrated into timing-driven optimization steps to provide signoff accuracy and expedite timing closure.
利用电流源模型和有效电容利用机器学习进行门级定时估计
随着工艺技术的扩展,精确的门级时序分析变得更加具有挑战性。高电阻片上互连对时序的影响越来越大,信号不再像平滑的饱和斜坡,而栅极互连的相互依赖性更强。此外,效率是一个严重的问题,因为在现代VLSI电路的增量优化过程中反复调用签名工具已成为主要瓶颈。在本文中,我们介绍了一种新的机器学习方法,用于门级的时序估计,该方法使用电流源模型和多摆和有效电容值的概念。首先,我们利用快速迭代算法进行初始阶段时间估计和特征提取,然后我们使用四个人工神经网络将驱动器和互连的初始延迟和旋转估计与黄金SPICE结果相关联。与之前的工作相反,我们的方法使用更少和更准确的特征来表示阶段,从而获得更高效的模型。对采用7nm FinFET技术实现的驱动器互连级的实验评估表明,我们的方法对SPICE的级延迟和电平转换的平均误差分别为0.99% (0.90 ps)和2.54% (2.59 ps)。此外,它的内存占用很小(1.27 MB),执行速度比商业签名工具快35倍。因此,它可以集成到时间驱动的优化步骤中,以提供签名准确性并加快时间关闭。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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