{"title":"High performance pump laser modules for erbium-doped fiber amplifiers","authors":"S. Huang, L. A. Greenberg, T.A. Corser","doi":"10.1109/ECTC.1993.346736","DOIUrl":null,"url":null,"abstract":"A 14-pin butterfly pump laser module for erbium-doped fiber amplifiers is described. A high coupling microlens has been realized by etching. A coupling efficiency of 74% has been measured for 1.48-/spl mu/m pump lasers with a variety of far-field angles. The etched microlens is fabricated by batch process and is highly manufacturable. This microlens also provides less reflection and thus interferes less with the operation of lasers. A /spl Delta/T of 60/spl deg/C was measured for an anticipated end-of-life laser chip power dissipation of 1.2 W. The observed performance degradation after a variety of thermal and mechanical shocks is found to be negligible. A maximum change of 5% in coupling efficiency was measured after 2000 hr of 85/spl deg/C bake. The TEC (thermoelectric cooler) resistance measurement showed negligible change, Less than 0.2 dB of temperature tracking error was observed from the routine fabrication data.<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1993.346736","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A 14-pin butterfly pump laser module for erbium-doped fiber amplifiers is described. A high coupling microlens has been realized by etching. A coupling efficiency of 74% has been measured for 1.48-/spl mu/m pump lasers with a variety of far-field angles. The etched microlens is fabricated by batch process and is highly manufacturable. This microlens also provides less reflection and thus interferes less with the operation of lasers. A /spl Delta/T of 60/spl deg/C was measured for an anticipated end-of-life laser chip power dissipation of 1.2 W. The observed performance degradation after a variety of thermal and mechanical shocks is found to be negligible. A maximum change of 5% in coupling efficiency was measured after 2000 hr of 85/spl deg/C bake. The TEC (thermoelectric cooler) resistance measurement showed negligible change, Less than 0.2 dB of temperature tracking error was observed from the routine fabrication data.<>