Elimination of Leakage in GaN-on-Diamond

B. Alvarez, D. Francis, F. Faili, F. Lowe, D. Twitchen, K. B. Lee, P. Houston
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引用次数: 6

Abstract

The use of chemical vapor deposition diamond as a substrate for gallium nitride (GaN) to form GaN- on-diamond has the potential to allow for higher linear power densities in GaN high electron mobility transistors (HEMTs). The increase in GaN HEMT power density on diamond has been limited to date by the electrical leakage in GaN-on-diamond substrates. In this paper we show that to eliminate buffer leakage in silicon based GaN-on- diamond, you have to completely remove the transition layers used to grow high quality GaN on the original host silicon. By completely removing the transition layers in GaN-on-diamond, we demonstrated buffer leakage comparable to the leakage in GaN on silicon carbide.
消除gan -on-金刚石中的泄漏
利用化学气相沉积金刚石作为氮化镓(GaN)的衬底来形成GaN- on-diamond,有可能在GaN高电子迁移率晶体管(hemt)中实现更高的线性功率密度。迄今为止,金刚石上氮化镓HEMT功率密度的增加一直受到金刚石上氮化镓衬底漏电的限制。在本文中,我们表明,为了消除硅基氮化镓在金刚石上的缓冲泄漏,你必须完全去除用于在原始宿主硅上生长高质量氮化镓的过渡层。通过完全去除金刚石上氮化镓的过渡层,我们证明了与碳化硅上氮化镓的泄漏相当的缓冲泄漏。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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