Surface mountable package (OptoBGA/sup TM/) for 10 G data link

Abstract

In an effort to provide a breakthrough in next-generation fiber optic data links, a new type of opto-electronic package has been developed using ceramic BGA technology (OptoBGA/sup TM/). In this paper, we describe how the OptoBGA/sup TM/ has adequate electrical performance meeting OC-192 or other 10 Gbs transmission specifications. For demonstration, a 10 G serial transmitter is designed and tested to achieve sufficient electrical eye opening of LD driver output when compared to its specifications (LD driver-pulse transient time 35 ps, Imod=100 mA, 20-80%).