GaAs foundry technologies

Abstract

GaAs wafer foundry has become an integral part of the RF/microwave semiconductor supply chain. A credible GaAs foundry has to establish its internal capability on developing cutting-edge technologies to meet the fast increasing product performance requirements in both mobile and infrastructure markets. Flip-chip bumping process, BiHEMT, mmW pHEMT, and high power GaN HEMT are clearly the critical technologies taking the microwave/mmW products toward higher performance, greater bandwidth, and higher power with smaller form factors.