An Optimum Layer Assignment for Routing in ICs and PCBs

M. Ciesielski, E. Kinnen
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引用次数: 44

Abstract

An optimum layer assignment of interconnections in IC and two-layer PCB is derived. The assignment is optimal in the sense that it is achieved through a global minimization of contacts or vias. The problem is formulated as a 0,1 integer program and solved using a branch and bound technique. There are no constraints on contact location or on the number of wires that can be connected at each contact. Applications of this procedure to VLSI circuits are discussed.
集成电路和pcb布线的最佳层分配
导出了集成电路和两层PCB中互连的最佳层分配方法。从某种意义上说,分配是最优的,它是通过接触或过孔的全局最小化来实现的。该问题被表示为一个0,1整数规划,并使用分支定界技术求解。在触点位置或在每个触点可以连接的电线数量上没有限制。讨论了该程序在VLSI电路中的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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