Cross layer resiliency in real world

V. Chandra, S. Mitra, Chen-Yong Cher, S. M. Müller
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Abstract

Resilience at different design hierarchies will be needed in Complex SoCs to handle failures due to variability, reliability and design errors (logical or electrical). The main reasons for the marginal behavior are sheer design complexity, uncertainties in manufacturing processes, temporal variability and operating conditions. In this session, we will cover the basics of cross layer resiliency and explore the reliability challenges in both embedded processors as well as large scale computing resources.
现实世界中的跨层弹性
复杂soc需要不同设计层次的弹性来处理由于可变性、可靠性和设计错误(逻辑或电气)而导致的故障。边际行为的主要原因是纯粹的设计复杂性,制造过程中的不确定性,时间变异性和操作条件。在本次会议中,我们将介绍跨层弹性的基础知识,并探讨嵌入式处理器和大规模计算资源中的可靠性挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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