{"title":"A new collector structure for thin wafer NPT-IGBT with low dose p- Si injection layer and high dose p+ Ge contact layer","authors":"T. Sugiyama, H. Ueda, M. Ishiko","doi":"10.1109/WCT.2004.240352","DOIUrl":null,"url":null,"abstract":"We have proposed a new collector structure for thin wafer IGBTs to improve contact resistances without sacrificing turnoff losses. The proposed structure has a low dose p- Si injection layer and a high dose p+ Ge contact. We also demonstrate, for the first time, the performance of 1.2 kV 200 A class thin wafer NPT IGBTs using this new collector structure. As a result, from simulations and measurements, we found that the high dose p+ Ge layer acts to suppress the hole-injection and also provides low contact resistances without consequently sacrificing turnoff losses.","PeriodicalId":303825,"journal":{"name":"2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs","volume":"195 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 Proceedings of the 16th International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WCT.2004.240352","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
We have proposed a new collector structure for thin wafer IGBTs to improve contact resistances without sacrificing turnoff losses. The proposed structure has a low dose p- Si injection layer and a high dose p+ Ge contact. We also demonstrate, for the first time, the performance of 1.2 kV 200 A class thin wafer NPT IGBTs using this new collector structure. As a result, from simulations and measurements, we found that the high dose p+ Ge layer acts to suppress the hole-injection and also provides low contact resistances without consequently sacrificing turnoff losses.