A new collector structure for thin wafer NPT-IGBT with low dose p- Si injection layer and high dose p+ Ge contact layer

T. Sugiyama, H. Ueda, M. Ishiko
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引用次数: 5

Abstract

We have proposed a new collector structure for thin wafer IGBTs to improve contact resistances without sacrificing turnoff losses. The proposed structure has a low dose p- Si injection layer and a high dose p+ Ge contact. We also demonstrate, for the first time, the performance of 1.2 kV 200 A class thin wafer NPT IGBTs using this new collector structure. As a result, from simulations and measurements, we found that the high dose p+ Ge layer acts to suppress the hole-injection and also provides low contact resistances without consequently sacrificing turnoff losses.
一种具有低剂量p- Si注入层和高剂量p+ Ge接触层的NPT-IGBT薄片集电极结构
我们提出了一种新的集电极结构,用于薄晶片igbt,以提高接触电阻而不牺牲关断损耗。该结构具有低剂量p- Si注入层和高剂量p+ Ge接触层。我们还首次展示了使用这种新集电极结构的1.2 kV 200a级薄晶片NPT igbt的性能。因此,从模拟和测量中,我们发现高剂量p+ Ge层抑制了空穴注入,并且在不牺牲关断损耗的情况下提供了低接触电阻。
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