Autoclave vs. 85°C/85% R. H. Testing - A Comparison

17th International Reliability Physics Symposium Pub Date : 1979-04-01 DOI:10.1109/IRPS.1979.362883

William J. McGarvey

引用次数: 7

Abstract

The wide use of plastic encapsulated MOS-LSI integrated circuits (IC) has aroused much concern regarding moisture integrity testing. This paper discusses the results of both unbiased autoclave testing and 85°C/85% R.H. testing. Comparisons are made based on failure rate data, and a heuristic acceleration factor is determined.

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高压灭菌器与85°C/85% rh测试-比较

塑料封装MOS-LSI集成电路(IC)的广泛应用引起了人们对水分完整性测试的关注。本文讨论了无偏高压灭菌器试验和85°C/85% rh试验的结果。基于故障率数据进行了比较，并确定了启发式加速因子。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

17th International Reliability Physics Symposium

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