An Attachment Level Design Process for Snap-Fit Applications

P. R. Bonenberger
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引用次数: 0

Abstract

The Attachment Level Methodology (ALM) defines a snap-fit as a system of interacting features. This leads to a fundamental paradigm for understanding and developing snap-fit attachments. Thus, the ALM is a design for assembly (DFA) enabler. The methodology was created to improve snap-fit development from concept through detailed design. The ALM supports profound understanding of snap-fits through its content and organization. It also supports a rational yet creative development process for snap-fit applications. Previous papers have described specific aspects of the ALM: (key requirements, elements and enhancements). This paper describes how they are used in a step-by-step snap-fit development process. In addition to ensuring that important interface criteria are considered in a logical manner, this process encourages creativity and improved spatial reasoning during snap-fit development. A review of attachment level terminology is provided. The snap-fit development process is then described. Feasibility of extending the process to other attachment methods is also noted.
Snap-Fit应用程序的附件级设计过程
附件级别方法学(ALM)将snap-fit定义为一个交互特性的系统。这导致了理解和开发卡扣式附件的基本范例。因此,ALM是装配设计(DFA)推动者。该方法的创建是为了从概念到详细设计改进snap-fit开发。ALM通过其内容和组织支持对快照的深刻理解。它还支持快速贴合应用程序的合理而富有创造性的开发过程。以前的论文描述了ALM的具体方面:(关键需求、要素和增强)。本文描述了它们是如何在一步一步的快速适配开发过程中使用的。除了确保以逻辑的方式考虑重要的界面标准外,这个过程还鼓励创造力,并在快速贴合开发过程中提高空间推理能力。提供了附件级别术语的回顾。然后描述了snap-fit开发过程。还指出了将该工艺扩展到其他附着方法的可行性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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