On double sided cooling

G. Feix, M. Hutter, E. Hoene, K. Lang
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Abstract

Since about 15 years back, there were several attempts to increase power density by double-sided cooling of power semiconductors, mostly by a sandwich stack with two DCBs. This paper gives an overview over the developments and approaches over the last years and some results of another project concerning double sided cooling.
双面冷却
从大约15年前开始,有几次尝试通过功率半导体的双面冷却来提高功率密度,主要是通过带有两个dcb的三明治堆叠。本文概述了近年来的发展和方法,以及另一个关于双面冷却的项目的一些结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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