Analysing Interface Bonding in 5G WLANs

Abstract

This work proposes a simple analytical model for interface bonding in 5G WLANs at the 2.4 GHz and 60 GHz ISM bands. Based on previous analysis of the IEEE 802.11 DCF by Bianchi and Chatzimisios, an expression for the predicted throughput of the bonded interface is given as a function of the number of competing wireless nodes in each network.The model is implemented and validated in MatLab using the Monte Carlo method. When applied to a practical interface bonding scenario, the model results suggest a practical limit of fifteen 2.4 GHz nodes when bonded with a 60 GHz interface, above which the resulting compound throughput is less than that of a single 60 GHz interface.