Modelling power LEDs in the COB case with thermal phenomena taken into account

Abstract

The paper refers to modelling power light emitting diodes (LEDs) in the SPICE software with thermal phenomena taken into account. The electro-thermo-optical model of such diodes contained in the common chip on the board (COB) case and the results of experimental verification of the correctness of this model are presented. A good agreement between the results of calculations and measurements was obtained, for operation of the considered diode both in static and dynamic conditions.