Mixed-level and mixed-domain modeling and simulation for optical interconnect design

Abstract

The physical-layer design of optical interconnects for box-to-box, backplane, intra-board, and intra-chip applications must address a number of considerations including system performance, manufacturing yield, reliability, power consumption, thermal properties, and cost. Also, there are multiple levels of abstraction and domains over which optical interconnect designs must be addressed. For a complete design solution, modeling and simulation across the multiple levels of abstraction in both electronic and optical domains is required. We present novel modeling and simulation approaches that address this challenge.