Production engineering features of millimeter wave dielectric integrated circuits

13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003. Pub Date : 1900-01-01 DOI:10.1109/CRMICO.2003.158940

B. Yemelyanenkow

引用次数: 0

Abstract

Described in this paper is the process of manufacturing of complex elements of millimeter wave dielectric integrated circuits (DIC) on the base of image dielectric guides. Production engineering errors of DIC elements are studied. The features of DIC manufacturing on the base of image dielectric guides in 80-120 GHz frequency band are defined in the process of experimental investigations.

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毫米波介质集成电路的生产工程特点

本文介绍了基于图像介质波导的毫米波介质集成电路(DIC)复杂元件的制造工艺。研究了DIC元件的生产工程误差。在实验研究过程中，明确了80 ~ 120ghz频段成像介质波导DIC制造的特点。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

13th International Crimean Conference Microwave and Telecommunication Technology, 2003. CriMiCo 2003.

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