Processing Induced Warpage in Composite Cylindrical Shells

T. Meink, M. Shen
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引用次数: 8

Abstract

This paper investigates a cause for warpage in structures manufactured using filament winding or fiber placement. This warpage phenomena has been determined to be caused by fiber/resin consolidation resulting from manufacturing parameters including: cure pressure, winding tension, and material system characteristics. This is a non-thermal phenomena and is independent of cure temperature, or finished part operational environments. A novel theory has been developed to predict the warpage or “springback” resulting from the processing induced strain gradient that develops in laminates due to the consolidation. This paper utilizes a strain model derived previously to develop a warpage prediction model utilizing Classical Laminated Plate Theory (CLT). This theoretical solution is than compared to experimental results for hoop wound test specimens. The end goal of the research is to develop a springback prediction model that can be applied to large scale parts utilizing consolidation parameters measured at the coupon level.
复合材料圆柱壳的加工诱发翘曲
本文研究了长丝缠绕或纤维放置制造的结构翘曲的原因。这种翘曲现象被确定是由纤维/树脂固结引起的,这些固结由制造参数引起,包括:固化压力、缠绕张力和材料系统特性。这是一种非热现象,与固化温度或成品操作环境无关。一种新的理论已经发展到预测翘曲或“回弹”造成的加工诱导应变梯度,在层合板由于固结发展。本文利用已有的应变模型,利用经典叠合板理论(CLT)建立了翘曲预测模型。该理论解与环绕试验试样的实验结果进行了比较。研究的最终目标是开发一种回弹预测模型,该模型可以应用于大型部件,利用在优惠券水平上测量的固结参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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