Image analysis of solder spread factor on different material types

Abstract

This article deals with the image analysis of the solder spread factor on the different material types and surface finishes. The spread factor of the solders is one of the tools which should be used to solderability and wetability quantification. Two types of solders (Sn62Pb36Ag2, Sn95,5Ag4Cu0,5) four types of material (lead free H.A.L., passivated copper, immersion tin plating, chemical gold plating) ware used in experiment. Three types of different roughness of the surface finish were used in case of cooper material. The differences between the solder spread factor on the different types of material and surface finishes ware evaluated by image analysis of the spread factor surface.