Packaging and system integration of microwave and digital monolithic IC's

Abstract

A single firing, multilayer process which uses a combination of thick- and thin-film metallization on hardened ceramic has been developed. This technology promotes the integration of digital, analog, and microwave circuit designs onto a single multilayer substrate. It provides an increase in interconnect density, a reduction in the number of parts, and a decrease in assembly operations. This packaging approach, known as STRATEDGE, provides greater design flexibility and superior electrical performance for microwave products such as couplers, filters, MMIC modules, delay lines, and millimeter-wave packages.<>