Bias Stress Induced Conduction Mechanism Evolution in Silica Based Inter-Metal Dielectrics

Abstract

The real-time conduction mechanism evolution during bias stress of three silica based inter-metal dielectrics in Cu damascene structures was investigated. Capacitance measurements at 1 MHz and I-V measurements were intermittently inserted into the process of bias stress to monitor the conduction mechanism evolution with time. All experiments show that the capacitance is constant and the I-V curve slope decreases with bias stress and converges to the half of the initial value. Based on these findings, we conclude that the conduction mechanism changes from a normal Frenkel-Poole emission to an "abnormal" Frenkel-Poole emission with bias stress