Determination of BEOL Aluminum-Copper Constitutive Equation using FEA Simulation and Response Surface Methodology

Abstract

The constitutive equation model for a particular aluminum thin film deposited using Physical Vapor Deposition (PVD) process used in wafer fabrication Back End of Line (BEOL) has been determined by matching the data from experimental nanoindentation and Finite Element Analysis (FEA) simulation. The model used is a derivative of the Voce isotropic hardening model which is defined by three coefficients. The Linear Hardening Coefficient, Saturation Flow Stress and Saturation Exponent has been determined to be 21937 MPa, 135 MPa and 25 respectively.