Folded Y-junction in substrate-integrated waveguide technology

Abstract

This paper presents a novel Y-junction in folded substrate-integrated waveguide technology. The structure is analyzed with finite-element method using Ansys HFSS, and the simulation results show that the reflection coefficients of the 120° branch ports for the folded substrate-integrated waveguide Y-junction can satisfy the constraints for optimum performance of diplexers. In comparison with an unfolded substrate-integrated waveguide Y-junction, the characteristics of the presented structure can meet the constraints in a wider frequency band, which means that the flexibility for the selection of the up and down channel bands is increased.