Monolithic and hybrid microwave ICs

W. Wisseman, J. Gewartowski
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Abstract

Microwave ICs, using both hybrid and monolithic approaches, are being realized with both silicon and gallium arsenide technologies. The panel will discuss the advantages and limitations of the alternatives from performance, frequency, reliability and cost points of view.
单片和混合微波集成电路
微波集成电路,使用混合和单片方法,正在实现与硅和砷化镓技术。该小组将从性能、频率、可靠性和成本的角度讨论替代方案的优点和局限性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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