The microstrip coupled line Bandpass filter using LTCC technology for 5GHz wireless LAN application

Abstract

This paper presents a top-down design of the microstrip coupled line Band pass filter (BPF) embedded in low temperature co-fired ceramic (LTCC) for 5 GHz wireless LAN applications. It includes the design, simulation, fabrication and measurements. The filter circuit was designed and simulated based on Agilent Advanced Automation (ADS2005A) software. Then, the physical dimensions of components and the filter itself is subsequently determined and the physical design is later performed in the layout window of Empire XcCEL. All measured simulations are analyzed and compared to design specifications and characteristics (curve fitting). Any inaccuracy is taken into account where corrected design is further recovered.