Testing of Switch Blocks in Three-Dimensional FPGA

Takumi Hoshi, K. Namba, Hideo Ito
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引用次数: 2

Abstract

In recent years, programmable interconnects in Field Programmable Gate Arrays (FPGAs)become a bottleneck of improving performance. So, for improving performance of FPGAs, a design of programmable interconnects is a key element, and innovative routing architecture is being desired. From this viewpoint, three dimensional FPGAs (3D-FPGAs) were proposed and focused. 3D-FPGAs have multiple layers which connected by vertical wires through 3D- Switch Block (SB). The main difference between the structures of the traditional two dimensional (2D) FPGAs and 3D-FPGAs is in 3D-SBs, and thus parts in 3D-FPGAs other than the SBs can be tested using existing methods for 2D-FPGAs. However, 3D-SBs cannot be tested by traditional testing for 2D-FPGAs. This paper presents testing for 3D-SBs in 3D-FPGAs. The proposed testing can detect stuck-at, bridging, stuck-open and stuck-on faults on three-dimensional switch blocks, and requires five test configurations to detect these catastrophic faults.
三维FPGA中开关模块的测试
近年来,现场可编程门阵列(fpga)的可编程互连成为其性能提升的瓶颈。因此,为了提高fpga的性能,可编程互连的设计是一个关键因素,需要创新的路由体系结构。从这个角度出发,三维fpga (3d - fpga)被提出并受到关注。3D- fpga有多层,通过3D开关块(SB)的垂直导线连接。传统二维fpga和3d - fpga结构的主要区别在于3D-SBs,因此3d - fpga中除SBs之外的部分可以使用现有的2D- fpga方法进行测试。然而,3D-SBs无法通过传统的2d - fpga测试来测试。本文介绍了3D-SBs在3d - fpga中的测试。所提出的测试方法可以检测三维开关块的卡、桥、卡开和卡上故障,并且需要五种测试配置来检测这些灾难性故障。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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