{"title":"Testing of Switch Blocks in Three-Dimensional FPGA","authors":"Takumi Hoshi, K. Namba, Hideo Ito","doi":"10.1109/DFT.2009.26","DOIUrl":null,"url":null,"abstract":"In recent years, programmable interconnects in Field Programmable Gate Arrays (FPGAs)become a bottleneck of improving performance. So, for improving performance of FPGAs, a design of programmable interconnects is a key element, and innovative routing architecture is being desired. From this viewpoint, three dimensional FPGAs (3D-FPGAs) were proposed and focused. 3D-FPGAs have multiple layers which connected by vertical wires through 3D- Switch Block (SB). The main difference between the structures of the traditional two dimensional (2D) FPGAs and 3D-FPGAs is in 3D-SBs, and thus parts in 3D-FPGAs other than the SBs can be tested using existing methods for 2D-FPGAs. However, 3D-SBs cannot be tested by traditional testing for 2D-FPGAs. This paper presents testing for 3D-SBs in 3D-FPGAs. The proposed testing can detect stuck-at, bridging, stuck-open and stuck-on faults on three-dimensional switch blocks, and requires five test configurations to detect these catastrophic faults.","PeriodicalId":405651,"journal":{"name":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DFT.2009.26","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In recent years, programmable interconnects in Field Programmable Gate Arrays (FPGAs)become a bottleneck of improving performance. So, for improving performance of FPGAs, a design of programmable interconnects is a key element, and innovative routing architecture is being desired. From this viewpoint, three dimensional FPGAs (3D-FPGAs) were proposed and focused. 3D-FPGAs have multiple layers which connected by vertical wires through 3D- Switch Block (SB). The main difference between the structures of the traditional two dimensional (2D) FPGAs and 3D-FPGAs is in 3D-SBs, and thus parts in 3D-FPGAs other than the SBs can be tested using existing methods for 2D-FPGAs. However, 3D-SBs cannot be tested by traditional testing for 2D-FPGAs. This paper presents testing for 3D-SBs in 3D-FPGAs. The proposed testing can detect stuck-at, bridging, stuck-open and stuck-on faults on three-dimensional switch blocks, and requires five test configurations to detect these catastrophic faults.