Calibration of detailed thermal models by parametric dynamic compact thermal models

L. Codecasa, V. d’Alessandro, A. Magnani, N. Rinaldi
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引用次数: 15

Abstract

In this paper it is shown how parametric dynamic compact thermal models can be exploited for the calibration of detailed thermal models of electronic components and packages. A constrained least square fit of the thermal response of a parametric dynamic compact thermal model, having as parameters the material thermal properties and geometrical details to be calibrated, onto the measured temperature response is performed. Numerical results show that the use of parametric dynamic compact thermal models instead of detailed compact thermal models, in conjunction with an optimization algorithm solving the constrained least square problem, can reduce the computational time for calibration by more than two orders of magnitude.
用参数化动态紧凑热模型标定详细热模型
本文展示了如何利用参数化动态紧凑热模型来校准电子元件和封装的详细热模型。以待校准材料的热性能和几何细节为参数,对参数化动态紧凑热模型的热响应进行了约束最小二乘拟合。数值结果表明,采用参数化动态紧凑热模型代替精细紧凑热模型,结合求解约束最小二乘问题的优化算法,可将标定计算时间减少两个数量级以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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