Multiscale free-space optical interconnects for intrachip global communications

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004. Pub Date : 2004-06-28 DOI:10.1109/LEOSST.2004.1338712

M. McFadden, M. Iqbal, Michael W. Haney

引用次数: 4

Abstract

Optical intrachip global interconnects are discussed. Methods for replacing metal global interconnects with free-space optical interconnects are compared analytically to highlight the bandwidth capacity benefits of using a multiscale optical system for intrachip global communications.

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用于芯片内全局通信的多尺度自由空间光互连

讨论了光芯片的全局互连。分析比较了用自由空间光互连代替金属全局互连的方法，以突出使用多尺度光系统进行芯片内全局通信的带宽容量优势。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.

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