Advanced pixel design for infrared 3D LADAR imaging

F. Guellec, M. Tchagaspanian, E. de Borniol, P. Castelein, A. Perez, J. Rothman
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引用次数: 15

Abstract

CEA Leti has demonstrated the good performances of its MWIR HgCdTe avalanche photodiode arrays. Gains above 20 at a moderate bias voltage of 5V have typically been measured with an excess noise factor of only 1.2. The next generation of infrared focal plane arrays will take advantage of these characteristics to address new applications, reduce system complexity and enhance performances. One of the main opportunities offered by avalanche photodiode detectors concerns long range active imaging. This paper reports the development of two novel pixel architectures for 3D active imaging based on flash LADAR technology. Both pixels have been designed in a standard 0.35μm CMOS process and perform time-of-flight measurement in addition to 2D intensity imaging with a single emitted laser pulse. The analog input circuits have been optimized to allow fast pulse detection while providing robustness to process variability. A small readout IC demonstrator has been fabricated and coupled to a 10x10 avalanche photodiode array at 40μm pixel pitch. The first test results in lab conditions show good electro-optical performances with a ranging resolution around 30cm (2ns).
先进的红外三维雷达成像像素设计
CEA Leti已经证明了其MWIR HgCdTe雪崩光电二极管阵列的良好性能。在5V的中等偏置电压下,超过20的增益通常以仅为1.2的过量噪声因数进行测量。下一代红外焦平面阵列将利用这些特性来解决新的应用,降低系统复杂性并提高性能。雪崩光电二极管探测器提供的主要机会之一是远程主动成像。本文报道了基于flash LADAR技术的两种新型三维主动成像像素结构的发展。这两个像素都采用标准的0.35μm CMOS工艺设计,除了使用单发射激光脉冲进行二维强度成像外,还可以进行飞行时间测量。模拟输入电路已被优化,以允许快速脉冲检测,同时提供鲁棒性的过程可变性。制作了一个小型读出IC演示器,并以40μm像素间距耦合到10x10雪崩光电二极管阵列。在实验室条件下的第一次测试结果显示出良好的光电性能,测距分辨率约为30厘米(2ns)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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