Andrew C. Sabate, A. Hamid, Dineshwaran Naidu Gunalan
{"title":"Automotive customer returns tilted die resolution","authors":"Andrew C. Sabate, A. Hamid, Dineshwaran Naidu Gunalan","doi":"10.1109/IPFA.2016.7564257","DOIUrl":null,"url":null,"abstract":"Usual Failure Analysis steps may not guarantee the root cause for all failure mechanism type. It is inevitable that the failure may recover after decapsulation or backside grinding for some failure mechanism. The paper aims to discuss analysis approach used in resolving tilted die failure mechanism issue resulting to package re-design eliminating further quality issue with automotive customer.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"428 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564257","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Usual Failure Analysis steps may not guarantee the root cause for all failure mechanism type. It is inevitable that the failure may recover after decapsulation or backside grinding for some failure mechanism. The paper aims to discuss analysis approach used in resolving tilted die failure mechanism issue resulting to package re-design eliminating further quality issue with automotive customer.