Electroless Copper Deposition into Anodic Aluminium Oxide on Aluminum Substrate

Abstract

In this work a technology for electroless copper deposition into nanoporous anodic aluminium oxide on copper metalized aluminium substrate was realized. The immersion copper layer on AI/AAO interface was used to catalyse the electroless plating. The characterization of the obtained copper layers was accomplished by optical and scanning electron microscopy, energy-dispersive X-ray and X-ray diffraction analysis.