A generalized method for the evaluation of mutual coupling in microstrip arrays

Abstract

An analytical method for the evaluation of mutual coupling in microstrip arrays is discussed. The elements of the array are excited by microstriplines printed on or embedded in the substrate. As an example, the mutual coupling between microstrip dipoles electromagnetically coupled to embedded strip transmission lines is evaluated accurately. The presented method is valid in the millimeter range as weft as at microwave frequencies and does not have any substrate limitations. Also, it accounts for conductor thickness and surface wave excitation. Comparison with experimental results shows excellent agreement.