The OTP Data Retention Improvement on CESL and SAB Film Scheme

B. Tsai, S. J. Chang, C. S.Ho, K. Chou, I. Wei, P. Tseng
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引用次数: 1

Abstract

The effects of silicide-blocked (SAB) oxide and contact etch stop layer (CESL) on the retention characteristic of one-time programming (OTP) nonvolatile memory (NVM) are experimentally evaluated through various deposition process conditions. The OTP retention is characterized after a baking condition of 250°C for 4 hrs. Our results suggest the NH3 and SiH4gas base deposition process effectively make improvements on OTP data retention. And the thicker the SAB film, the better the data retention.
基于CESL和SAB薄膜方案的OTP数据保留改进
通过不同的沉积工艺条件,实验评价了硅化物阻塞(SAB)氧化物和接触蚀刻停止层(CESL)对一次性编程(OTP)非易失性存储器(NVM)保留特性的影响。在250℃烘烤4小时后,对OTP的保留进行了表征。我们的研究结果表明,NH3和sih4气基沉积工艺有效地改善了OTP数据的保留。SAB膜越厚,数据保留效果越好。
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