A high efficiency ultra-deep sub-micron DC-DC converter for microprocessor applications

B. Reed, K. Ovens, J. Chen, V. Mayega, S. Issa
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引用次数: 8

Abstract

An integral part of the voltage scaling system for a microprocessor is the high-efficiency DC-DC converter, which directly provides the core Vdd. Built in an ultra-deep sub-micron (UDSM) baseline 90 nm process, this converter must meet several challenging design constraints. First, using only 30 angstrom CMOS, the design must convert to the nominal core voltage of 1.2 V from a direct-battery input that can be as high as 5.4 V. Second, the converter must detect the output current to switch between pulse-frequency modulation (PFM) and pulse-width modulation (PWM) modes thereby enabling efficient conversion at a broad range of loads. Finally, since there is no post-regulation of the output, this converter must have improved output accuracy without any additional external components. This paper highlights the design techniques used to overcome these challenges as well as the optimizations that can be done when the converter is fully integrated with the microprocessor. Also discussed are future designs that will migrate this converter to the baseline 65 nm process.
一种用于微处理器应用的高效超深亚微米DC-DC转换器
高效的DC-DC变换器是微处理器电压缩放系统的一个重要组成部分,它直接提供核心Vdd。该转换器采用超深亚微米(UDSM)基准90纳米工艺,必须满足几个具有挑战性的设计限制。首先,仅使用30埃CMOS,该设计必须从可高达5.4 V的直接电池输入转换为1.2 V的标称核心电压。其次,转换器必须检测输出电流以在脉冲频率调制(PFM)和脉冲宽度调制(PWM)模式之间切换,从而在广泛的负载范围内实现有效的转换。最后,由于没有输出后调节,该转换器必须在没有任何额外外部组件的情况下提高输出精度。本文强调了用于克服这些挑战的设计技术,以及当转换器与微处理器完全集成时可以完成的优化。还讨论了将该转换器迁移到基准65nm工艺的未来设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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