Throughput improvement in photolithography processing for flexible production

S. Yajima, T. Nakano, K. Sadachi, Y. Ikura, H. Miura, A. Tomozawa
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Abstract

During the drastic product change from memory devices to discrete devices, we have made various technical improvements in photolithography processing corresponding to its design characteristics, as follows: (1) establishment of fine gate processing technology; (2) optimization of throughput and processing accuracy using new photoresist processing customized for each step; and (3) establishment of flexible stepper application methods aimed at products-change-free production. Consequently, we have obtained the following beneficial results: (1) processing of 0.25 /spl mu/m discrete devices has been set up without KrF lithography; (2) a 198% improvement in stepper throughput has been achieved; and (3) a 58% reduction of waiting time has been obtained.
柔性生产中光刻工艺的吞吐量改进
在从存储器件到离散器件的巨大产品变革过程中,我们针对其设计特点对光刻工艺进行了各种技术改进,具体如下:(1)建立了精细栅极加工工艺;(2)采用针对每个步骤定制的新型光刻胶工艺,优化吞吐量和加工精度;(3)建立以产品无变化生产为目标的柔性步进应用方法。因此,我们获得了以下有益的结果:(1)在没有KrF光刻的情况下,建立了0.25 /spl mu/m分立器件的处理;(2)步进处理量提高198%;(3)等待时间减少了58%。
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