Characterizations of interconnects formed in electromagnetic bandgap substrates

Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005. Pub Date : 2005-05-10 DOI:10.1109/SPI.2005.1500903

A. Suntives, R. Abhari

引用次数: 6

Abstract

In this paper, several interconnect geometries - single interconnect and multiple lines - formed in electromagnetic bandgap substrates are investigated through simulations and measurements. Microstrip lines are used as a benchmark to evaluate the performance of the prototype structures.

查看原文本刊更多论文

电磁带隙衬底中形成的互连特性

本文通过仿真和测量研究了在电磁带隙衬底上形成的几种互连几何形状——单互连和多线互连。利用微带线作为基准来评价原型结构的性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.

自引率

0.00%

发文量