Defect level prediction for newly designed Printed Circuit Board Assemblies

2009 32nd International Spring Seminar on Electronics Technology Pub Date : 2009-05-13 DOI:10.1109/ISSE.2009.5207033

R. Soukup

引用次数: 1

Abstract

In this paper a new defect level prediction tool is presented, which is intended for newly designed printed circuit board assemblies, especially for the PCBAs (Printed Circuit Board Assembly) determined for automotive industry. The tool is programmed in Visual Basic for Application (VBA) and can be operated in MS Excel environment.

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新设计印刷电路板组件的缺陷等级预测

本文提出了一种新的缺陷水平预测工具，该工具适用于新设计的印刷电路板组件，特别是汽车工业中确定的印刷电路板组件。该工具采用Visual Basic for Application (VBA)编程，可在MS Excel环境下运行。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2009 32nd International Spring Seminar on Electronics Technology

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