PSPICE modeling of Silicon Carbide MOSFETS and device parameter extraction

A. Bilbao, S. Bayne
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引用次数: 4

Abstract

The goal of this research is to develop device models for Silicon Carbide (SiC) MOSFETs. Parameters are extracted and used to create PSPICE models that can be utilized for circuit simulation. Two silicon carbide power MOSFETs made available by CREE Semiconductor are considered. The first silicon carbide power MOSFET tested is the CMF20120A64410. This MOSFET features a 1200V drain-to-source breakdown voltage and 30A continuous current capacity. The second device tested is an experimental MOSFET that is still not available in the market as of the date of this paper. The experimental MOSFET features a 1200V drain-to-source breakdown voltage and 80A continuous current capability. Custom made circuits are developed for extracting some of the parameters. In some cases where the tests only require low drain current, a HP B1505A curve tracer is used to aid the development of the model. The effect of temperature over the gate threshold voltage is also investigated. By externally increasing and monitoring the die temperature of the SiC MOSFETs, new device parameters can be extracted and modeled. Once the parameters are extracted they are converted into a PSPICE model. The model is tested and compared to the real device to verify accuracy. This is achieved using custom switching circuits with both inductive and resistive loads and software suites like MATLAB.
碳化硅mosfet的PSPICE建模及器件参数提取
本研究的目标是开发碳化硅(SiC) mosfet的器件模型。提取参数并用于创建可用于电路仿真的PSPICE模型。考虑了CREE半导体提供的两个碳化硅功率mosfet。测试的第一个碳化硅功率MOSFET是CMF20120A64410。该MOSFET具有1200V漏源击穿电压和30A连续电流容量。测试的第二个器件是实验性MOSFET,截至本文发布之日,该器件仍未在市场上销售。实验MOSFET具有1200V漏源击穿电压和80A连续电流能力。定制的电路被开发用于提取一些参数。在某些测试只需要低漏极电流的情况下,使用HP B1505A曲线示踪器来帮助开发模型。研究了温度对栅极阈值电压的影响。通过外部增加和监测SiC mosfet的芯片温度,可以提取和建模新的器件参数。一旦参数被提取出来,它们就被转换成PSPICE模型。对模型进行了测试,并与实际装置进行了对比,验证了模型的准确性。这是通过使用带有电感和电阻负载的定制开关电路以及MATLAB等软件套件来实现的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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