Reliability Analysis

C. Bhargava
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引用次数: 1

Abstract

As the integration of components are increasing from VLSI to ULSI level. This may lead to damage of electronic system because each component has its own operating characteristics and conditions. So, health prognostic techniques are used that comprise a deep insight into failure cause and effects of all the components individually as well as an integrated technique. It will raise alarm, in case health condition, of the components drift from the desired outcomes. From toy to satellite and sand to silicon, the major key constraint of designing and manufacturing industry are towards enhanced operating performance at less operating time. As the technology advances towards high-speed and low-cost gadgets, reliability becomes a challenging issue.
可靠性分析
随着元器件集成度从VLSI到ULSI水平的不断提高。这可能会导致电子系统的损坏,因为每个组件都有自己的工作特性和条件。因此,使用的健康预测技术包括对所有组件的故障原因和影响的深入了解以及综合技术。如果组件的健康状况偏离预期结果,它将发出警报。从玩具到卫星,从沙子到硅,设计和制造业的主要关键约束是在更短的工作时间内提高操作性能。随着技术向高速和低成本的方向发展,可靠性成为一个具有挑战性的问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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