Termination with Stubs in Resistive Film

Abstract

In recent years, T/R modules have required surface mount terminations with high-power capability for cost reduction. Terminations with large resistive film on aluminum nitride have been proposed as a method for high power use. However, they have a problem that it is difficult to obtain the broadband terminations. Therefore, we propose a novel termination with stubs in resistive film. This termination can disperse heat by resonating an input signal with open stubs. Hence, the proposed termination improved surface loss density by 50% compared to the conventional one. In addition, we show that the fabricated termination has the reflection coefficient characteristics smaller than −20B in the bandwidth of 43.3%.