Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration

2019 International 3D Systems Integration Conference (3DIC) Pub Date : 2019-10-01 DOI:10.1109/3DIC48104.2019.9058871

P. Ramm, A. Klumpp, C. Landesberger, J. Weber, A. Heinig, P. Schneider, Guenter Elst, M. Engelhardt

引用次数: 1

Abstract

Pioneering contributions of Fraunhofer in the field of 3D IC integration are presented, as well as recent 3D design and technology developments with a dedicated focus on the application of heterogeneous systems.

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弗劳恩霍夫在3D集成电路方面的初步和持续贡献

介绍了Fraunhofer在3D IC集成领域的开创性贡献，以及最近的3D设计和技术发展，专注于异构系统的应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2019 International 3D Systems Integration Conference (3DIC)

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