HT/sub c/ superconductive interconnections for ultra fast logic circuits

Abstract

The authors present modeling results in frequency domain and experimental validation of superconductive transmission lines. SPICE simulations have demonstrated the advantages of using the high T/sub c/ superconductive interconnections for applications to fast logic circuits and their integration in multichip modules. Low losses of these materials allow novel devices to be studied (delay lines, devices with controlled dispersion, etc.).<>