Comparison of BBSPICE to PEEC Equivalent Circuit Models for Simulation of Floating PCB Above Ground Plane

H. Hackl, Martin Ibel, B. Auinger, C. Stockreiter, B. Deutschmann
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引用次数: 1

Abstract

Floating, i.e. not locally grounded, printed circuit boards (PCBs) at the end of a long harness and above a large ground plane are common in automotive applications. A problem in modeling such setups is the missing ground reference at the PCB side. In this work, two equivalent circuit models are extracted from PCB design data, one based on a broadband SPICE (BBSPICE) netlist generated from S-parameter simulation and the other obtained by partial element equivalent circuit (PEEC) method. They are compared against measurements results of a demonstrator PCB in above described setup. Investigations include the verification of both modeling approaches with respect to low frequency behavior, broadbandness, sensitivity to PCB circuitry modifications and grounding scheme, as well as model generation effort and simulation times.
BBSPICE与PEEC等效电路模型在浮于地平面的PCB仿真中的比较
浮动,即不局部接地,印刷电路板(pcb)在长线束的末端和大接地面之上,在汽车应用中很常见。建模这种设置的一个问题是PCB侧缺少接地参考。本文从PCB设计数据中提取了两个等效电路模型,一个是基于s参数仿真生成的宽带SPICE (BBSPICE)网表,另一个是通过部分元件等效电路(PEEC)方法获得的。在上述设置中,它们与演示PCB的测量结果进行了比较。研究包括验证两种建模方法的低频行为、带宽、对PCB电路修改和接地方案的敏感性,以及模型生成的工作量和仿真时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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