MEMS as low-cost high-volume semiconductor solutions: it's all in the packaging and assembly

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI:10.1117/12.778250
Joe Brown, M. Lutz, A. Partridge, P. Gupta, E. Radza
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引用次数: 1

Abstract

Micro-electromechanical (MEMS) oscillators are now in production and shipping in quantity. Early development of micro mechanical devices provided the understanding that metal beams could be fabricated and they would resonate as a time reference. The issues of performance and price have prevented silicon entry into the quartz dominated market until recent developments in semiconductor processing and assembly. Today MEMS oscillators are the world's smallest programmable precision oscillators and are displacing quartz technology in the +/- 50 ppm accuracy spec. New oscillators extend the technology with spread spectrum, voltage control, and improved jitter performance. New ultra-thin packaging, made possible by the small encapsulated MEMS resonators, provides the word's thinnest precision oscillators.
MEMS作为低成本的大批量半导体解决方案:一切都在封装和组装中
微机电(MEMS)振荡器现已批量生产和出货。微机械装置的早期发展使人们认识到金属梁是可以制造的,它们可以作为时间参考产生共鸣。性能和价格的问题阻碍了硅进入石英主导的市场,直到最近在半导体加工和组装方面的发展。今天,MEMS振荡器是世界上最小的可编程精密振荡器,并且正在取代石英技术的+/- 50 ppm精度规格。新的振荡器扩展了扩频,电压控制和改进的抖动性能。新的超薄封装,使小型封装MEMS谐振器成为可能,提供了世界上最薄的精密振荡器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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