Validity of mutual inductor model for electromagnetic coupling between vias in integrated-circuit packages and printed circuit boards

Abstract

The procedure of extracting mutual inductor model between vias is demonstrated. Then the validity of the mutual inductor model is studied by comparing the solution from the mutual inductor model with that from the full-wave field simulation. It is found that the valid frequency range of the mutual inductor model is mostly determined by the lowest resonant frequency of the package structure.