Device Engineering and Performance Optimization of Silicon PICs for 800Gb/s Coherent Transmission

2023 Optical Fiber Communications Conference and Exhibition (OFC) Pub Date : 2023-03-01 DOI:10.23919/OFC49934.2023.10117024

Hao Wu, Chen Zhu, N. Cheng, Chen-lei Li, Min Teng, Pan Sun, Feng Wang, Yinchao Du, Gang Cheng, Xuezhe Zheng

引用次数: 0

Abstract

An end-to-end link model is developed to optimize silicon PIC and evaluate the coherent system performance. 128Gbaud 16-QAM data transmission based on silicon photonics is achieved with -9.1dBm Tx-output power and 26dB Rx OSNR sensitivity.

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800Gb/s相干传输硅PICs的器件工程与性能优化

建立了端到端链路模型，以优化硅PIC和评估相干系统的性能。采用-9.1dBm的tx输出功率和26dB Rx的OSNR灵敏度，实现了基于硅光子学的128Gbaud 16-QAM数据传输。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2023 Optical Fiber Communications Conference and Exhibition (OFC)

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