The practical use of residual gas analysis in a semiconductor thermal processing module

J. Hashem, B. Bradshaw
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Abstract

In this paper, we will discuss the application of a portable Residual Gas Analyzer (RGA) for characterizing and troubleshooting diffusion furnaces and rapid thermal anneal (RTA) reactors in the thermal module at Kilby Fab (KFAB) of Texas Instruments Inc. The tools characterized were Tokyo Electron Ltd. (TEL) vertical atmospheric furnaces, TEL vertical LPCVD furnaces and Applied Materials (AMAT) Rapid Thermal Annealers and Rapid Thermal Processors. Some aspects of the coordination of this operation in a manufacturing environment will also be discussed.
残余气体分析在半导体热处理模块中的实际应用
在本文中,我们将讨论便携式残余气体分析仪(RGA)在德州仪器公司Kilby Fab (KFAB)热模块中扩散炉和快速热退火(RTA)反应器的表征和故障排除的应用。表征的工具是东京电子公司(TEL)的垂直常压炉,TEL垂直LPCVD炉和应用材料公司(AMAT)的快速热退火器和快速热处理器。还将讨论在制造环境中协调这一操作的一些方面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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