A Wideband mmWave Array Antenna Package Based on Glass Integrated Passive Device

Donglin Gao, N. Khiabani, Ching-Wen Chiang, Yen-Cheng Kuan, Chung-Tse Michael Wu
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引用次数: 1

Abstract

A mmWave antenna-in-package ($AiP$) design for a tightly connected bowtie array antenna using glass integrated passive device (GIPD) technology on a multilayer printed-circuit-board (PCB) is presented. The resulting GIPD antenna array is flip-chipped on the PCB using gold studs. The proposed 5 × 5 AiP array shows a bandwidth of 58 - 85 GHz, 89 - 94 GHz, and 98 - 100 GHz with differential VSWR ≤ 3.5 through the measurement when the central antenna element is excited differentially through a vertical coax-via-based feeding structure. The simulated results are validated by measuring the fabricated prototype, demonstrating a reasonable agreement in differential VSWR and radiation characteristics.
基于玻璃集成无源器件的宽带毫米波阵列天线封装
提出了一种基于多层印刷电路板(PCB)的玻璃集成无源器件(GIPD)技术的毫米波封装天线($AiP$)设计。由此产生的GIPD天线阵列使用金螺柱在PCB上倒装。采用垂直同轴通孔馈电结构对中心天线单元进行差分激励时,所设计的5 × 5 AiP阵列的带宽分别为58 ~ 85 GHz、89 ~ 94 GHz和98 ~ 100 GHz,差分驻波比≤3.5。通过对样机的测量,验证了仿真结果的正确性,证明了差分驻波比和辐射特性的合理一致性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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